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produck applicatin
1、soft packaging application field
2、application field of building materials decoration
3、electrical and electronic applications
产品分类
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product detail
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wr-8104/da8104  non-high barrier opp structure packaging security solution
type: solvent-free compound adhesive
trademark: kingho
price: 0.00
value:
0.00
产品详情

i. application field

mainlyused for extruded snack food, daily chemical, medical machinery and otherpackaging opp non-barrier structure composite and plastic structure 121 cooking application.

2.compound structure

applicablefor example: opp/al/pe(cpp),

opp/mpet/pe(cpp),opp/mcpp,ny/rcpp, etc.

3.application features

suitablefor opp non - high barrier structure

productsafety: comply with gb 4806.1-2016, gb 9685-2016, (eu)no 10/2011,fda21cfr175.105 and other standards;suitable for plastic cooking package at 121

4. instructionsfor use

pleaseread the product manual or consult the technical service personnel carefullybefore use to ensure correct use.


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